➀ A 6.1-magnitude earthquake occurred near Hualien, Taiwan, with no reported damage at the Hsinchu Science Park. ➁ TSMC, UMC, and other semiconductor factories reported no need for evacuation or significant impact on operations. ➂ AUO and Innolux confirmed the safety of personnel and normal operation of life support systems. ➃ The previous major earthquake in April caused significant disruptions, including wafer breakage and machine downtime, affecting the production of Nvidia chips and leading to halted quotations from Samsung and other memory chip manufacturers.
Related Articles
- Taiwan chipmaker UMC launches US$5 billion wafer fab facility in Singapore; 700 jobs to be created5 months ago
- 2% 2025 growth forecast for front-end fab equipment6 months ago
- What If TSMC becomes ASMC?6 months ago
- Faraday Reports Full Year 2024 Results7 months ago
- 1nm Revolution: TSMC’s Next-Gen Chip Plant to Transform Southern Taiwan7 months ago
- The Global Expansion of Advanced Semiconductor Packaging Facilities: A 2025 Outlook7 months ago
- Earthquake hits TSMC fabs8 months ago
- UMC Secures Major Advanced Packaging Order from Qualcomm, Challenging TSMC’s Dominance9 months ago
- Equipment sales hit record $113bn, says SEMI9 months ago
- TSMC Accelerates Construction of its First 2-Nanometer Fab in Kaohsiung, Taiwan9 months ago