<p>➀ The cost model for low-NA and high-NA EUV is analyzed, revealing that high-NA EUV single patterning is more expensive than double-patterning with existing low-NA machines.</p><p>➁ Multi-patterning low-NA EUV can achieve finer pitch features than high-NA.</p><p>➂ ASML's goal of shipping 20 high-NA EUV tools by 2028 is considered ambitious and challenging due to economic and technological hurdles.</p><p>➃ The economic challenges of high-NA are more severe than those of low-NA, despite potentially smaller technical challenges.</p><p>➄ The development of high-NA EUV involves compromises, including technical challenges with half-field stitching, depth of focus, and photoresist, as well as cost challenges compared to existing low-NA tools.</p><p>➅ Low-NA double patterning is presented as a cost-effective alternative to high-NA EUV.</p>