➀ Fudan University researchers have developed a scalable integration process for ultra-fast two-dimensional flash memory, aiming to address the speed limitations of current flash technologies. ➁ The team utilized chemical vapor deposition (CVD) to grow single-layer molybdenum disulfide as the channel material and optimized the interface engineering to achieve atomic-level flatness. ➂ The resulting flash memory devices offer 100,000 cycles of lifespan, 20 nanosecond programming speeds, and a 98% yield rate, significantly outperforming traditional silicon-based flash memory.
Related Articles
- NMI hosts industry conference in Glasgow with theme of growth4 months ago
- Philips sells MEMs foundry Xiver6 months ago
- Building a Fabless Semiconductor Business: A Practical Guide7 months ago
- China's Chip Industry: Breaking Through and Embracing Challenges10 months ago
- Toppan Photomask Rebrands as Tekscend Photomask, Signaling a New Era of Technological Advancement10 months ago
- Jiufengshan Lab Draws Nearly 30 Semiconductor Companies, Total Valuation Surpasses $10 Billion11 months ago
- Jinghe Integrated and Smartsens Unveil Industry's First 180MP Full-Frame CIS, Breaking Sony's Monopoly11 months ago
- Prof. Chen Wenxin Develops First Industrial Standard MOSFET Model and Stacked CFET Technology, Co-founds and Invests in Over 20 Companies11 months ago
- Fan-Out Panel-Level Packaging (FO-PLP): Ultimate Guideabout 1 year ago
- Bellezza process could replace copper with graphene in ICs4 months ago