<p>➀ The US government has imposed export controls on high-bandwidth memory (HBM) and semiconductor equipment to China to prevent China from acquiring key components for AI development.</p><p>➁ The US Commerce Department's Bureau of Industry and Security (BIS) announced the addition of specific HBM products to the list of controlled items.</p><p>➂ The controls apply to products with memory bandwidth density of over 2 gigabytes per square millimeter per second.</p>
Related Articles
- Huawei reportedly acquired two million Ascend 910 AI chips from TSMC last year through shell companies3 months ago
- 2% 2025 growth forecast for front-end fab equipment2 months ago
- The week in chip news: Intel gets a new CEO, China chip smuggling, AMD dominates3 months ago
- Chinese government shifts focus from x86 and Arm CPUs, gov't promoting RISC-V chips heavily3 months ago
- China's Cambricon posts first profit as demand for this Nvidia rival's AI processors explodes5 months ago
- US bans sales of 14nm and 16nm chips with over 30 billion transistors to China5 months ago
- In a private letter to U.S. President Biden, semiconductor industry groups blast incoming export rules5 months ago
- Bad year for China chip investment6 months ago
- Chinese companies are reportedly reluctant to adopt homegrown chips — domestic solutions are technologically too far behind6 months ago
- GlobalFoundries fined $500,000 for restricted chip exports to Chinese firm on U.S. entity list — chipmaker shipped $17 million worth of silicon wafers to China’s SJ Semiconductor7 months ago