➀ BEC Distribution宣布提供STMicroelectronics和onsemi的IGBT晶体管替代品;➁ 英特尔为其18A工艺赢得了亚马逊网络服务的客户;➃ AMD推出9x9mm汽车认证FPGA;➄ 英特尔CEO Pat Gelsinger阐述未来发展路线;➅ 英特尔预计将宣布35亿美元军事代工厂合同。
Related Articles
- AMD Ryzen 7 9800X3D vs Intel Core Ultra 9 285K Faceoff — Battle of the Gaming Flagships3 days ago
- Micron confirms memory price hikes as AI and data center demand surges2 months ago
- STH Q1 2025 Letter from the Editor Re-calibration and Expansion2 months ago
- Crucial Pro Overclocking DDR5-6400 C38 2x16GB Review: Deceitfully Fast2 months ago
- HP updates its OmniBook X line with a lattice-free keyboard, processors from AMD and Intel3 months ago
- The week in chip news: Intel gets a new CEO, China chip smuggling, AMD dominates3 months ago
- Nvidia says it shipped twice as many 50-series GPUs as 40-Series at launch, but it's a misleading comparison3 months ago
- TSMC pitches an Intel Foundry joint venture idea to NVIDIA, AMD, Broadcom, Qualcomm3 months ago
- TSMC and Intel foundry joint venture reportedly still in the works — AMD, Broadcom, and Nvidia approached3 months ago
- TSMC discussing Intel jv, reports Reuters3 months ago