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October 19
- Winbond to Launch 3D NOR New Products at November Show, Plans for Mass Production in the Next Year
➀ Winbond is developing 3D NAND and 3D NOR product lines as planned.
➁ The 3D NOR product will be introduced to customers at the Munich Electronics Show in November.
➂ The company plans to expand mass production of 3D NOR in the next year.
➃ The 192-layer 3D NAND is scheduled to enter mass production next year.
➄ The company's 3D Nor flash has completed chip testing last year.
➅ The product has a 20% market share in NOR Flash and uses exclusively developed 3D stacking technology.
➆ The company aims at high-margin markets such as automotive and industrial control.
➇ Another 3D NAND flash product is in the final stage of process adjustment and will be shipped for use in Nintendo game discs.
➈ It is expected to contribute to revenue in the second half of next year.