1. Samsung Electro-Mechanics announced it will supply high-performance chip boards for hyperscale data centers to AMD. 2. The chip boards are flip chip-ball grid array (FC-BGA). 3. This is the first official confirmation of the deal by Samsung Electro-Mechanics.
Related Articles
- Micron confirms memory price hikes as AI and data center demand surges4 months ago
- Mapping Licensing for Virtualization is Cool Now4 months ago
- Intel data center CPU sales hit the lowest point in 13 years5 months ago
- AMD Issues Warning, Stock Price Plummets5 months ago
- AMD's gaming revenue for PlayStation, Xbox, and Radeon fell 58% in 20245 months ago
- Su Zifeng's 2-hour Passionate Speech! Launches AMD's Strongest AI Chip, Flagship CPU at 100,000 per Core, with OpenAI and Microsoft as Supporting Actresses9 months ago
- STH Q3 2024 Letter from the Editor The Coolest Quarter10 months ago
- U.S. legislators criticize decision to resume Nvidia H20 GPU shipments to China — demand new export rules for AI hardwareabout 13 hours ago
- AMD Confirms Ryzen Threadripper Pro 9000WX Pricing, 96 Cores For $11,6991 day ago
- AMD reveals Ryzen Threadripper Pro 9000WX specs and pricing1 day ago