<p>➀ Researchers at Tianjin University developed a non-destructive 'soft-touch' testing method for micro-LED wafers using flexible 3D probes with minimal pressure (0.9 MPa) to prevent surface damage;</p><p>➁ The system achieves 1/10,000th the pressure of traditional probes, ensuring wafer integrity and extending probe lifespan to over 1 million cycles;</p><p>➂ This innovation addresses critical quality control challenges in micro-LED production, enabling efficient yield screening and showing potential for commercialization in flexible electronics.</p>