<p>➀ South Korean fab equipment maker Justem is developing hybrid bonding equipment for future high-bandwidth memory (HBM) applications; </p><p>➁ The company secured a 14 billion won (approx. $10.2 million) government-supported project, with 7.5 billion won in direct funding from South Korea's Ministry of Trade, Industry and Energy; </p><p>➂ This initiative aims to advance hybrid bonding technology critical for next-generation memory manufacturing, with prototype development expected by 2026.</p>