<p>➀ Inometri secured its first contracts to supply Through-Glass Via (TGV) inspection equipment to two companies, marking its entry into the semiconductor glass substrate market; </p><p>➁ The TGV process, critical for creating electrical pathways in glass substrates, is a key challenge in manufacturing, and Inometri's non-destructive X-ray and CT-based inspection tools address quality control needs; </p><p>➂ With glass substrates gaining traction for AI-driven semiconductor performance, Inometri aims to expand partnerships and expects additional contracts by year-end, positioning itself early in an emerging supply chain involving Intel, AMD, and Samsung.</p>