1. Intel's Embedded Multi-die Interconnect Bridge (EMIB) packaging technology is now supported by industry-standard Electronic Design Automation (EDA) tools. 2. Major EDA tool providers like Cadence, Siemens, and Synopsys have integrated support for EMIB into their products. 3. This integration is expected to enhance the design and testing processes for products utilizing EMIB technology.
Related Articles
- Intel releases new tool to measure gaming image quality — AI tool measures impact of upscalers, frame gen, others; Computer Graphics Video Quality Metric now available on GitHub2 days ago
- Firefox dev says Intel Raptor Lake crashes are increasing with rising temperatures in record European heat wave — Mozilla staff's tracking overwhelmed by Intel crash reports, team disables the function2 days ago
- Micron confirms memory price hikes as AI and data center demand surges4 months ago
- Jiang Shangyi: Intel is Now a 'Minor Player', Should Merge with Established Chip Technology Companies4 months ago
- Can Earthquake in Myanmar disrupt PC hardware production? Manufacturers are checking out4 months ago
- Semiconductor CapEx Down in 2024 up in 20254 months ago
- STH Q1 2025 Letter from the Editor Re-calibration and Expansion4 months ago
- ‘high-end’ Intel Battlemage GPU was reportedly cancelled in late 20244 months ago
- Intel Allegedly Scraps High-End Battlemage GPU, GeForce Alone At The Top4 months ago
- Crucial Pro Overclocking DDR5-6400 C38 2x16GB Review: Deceitfully Fast4 months ago