➀ Broadcom showcased an AI compute ASIC with optical attach at Hot Chips 2024, highlighting its use of co-packaged optics and silicon photonics. ➁ The company discussed the challenges of electrical I/O reach through PCB and the benefits of using silicon photonics for optical modules. ➂ Broadcom's Tomahawk 5 Bailly, a 51.2T Ethernet switch, demonstrates the integration of co-packaged optics and improved packaging techniques.
Related Articles
- TSMC pitches an Intel Foundry joint venture idea to NVIDIA, AMD, Broadcom, Qualcomm3 months ago
- TSMC and Intel foundry joint venture reportedly still in the works — AMD, Broadcom, and Nvidia approached3 months ago
- TSMC discussing Intel jv, reports Reuters3 months ago
- ByteDance's custom chip made by Broadcom has been canceled, Broadcom to lose $2B to $3B3 months ago
- Samtec Advances Multi-Channel SerDes Technology with Broadcom at DesignCon3 months ago
- Broadcom and TSMC Consider Splitting Intel: A Groundbreaking Potential Deal4 months ago
- OpenAI to tape-out on TSMC 3nm this year4 months ago
- Device automatically encrypts server-to-storage data transfers4 months ago
- Broadcom's HBM4: A New Player in the Semiconductor Market?4 months ago
- In a private letter to U.S. President Biden, semiconductor industry groups blast incoming export rules5 months ago