<p>➀ Intel introduced a new double-wide OCP NIC 3.0 DSFF card with 8x 25GbE ports, delivering 200Gbps bandwidth via the E830 controller;</p><p>➁ The card uses a unique dual small form factor (DSFF) design with a single PCIe Gen4 x16/Gen5 x8 interface, enabling high-density networking in compact edge servers;</p><p>➂ Demonstrated at HPE Discover 2025, it targets edge computing scenarios where dual cards could provide 16x 25GbE ports in 1U servers for enhanced connectivity.</p>
Related Articles
- HPE OCP NIC 3.0 Intel i350-T4 Quick Look3 months ago
- Intel Holiday Bundle Gifts Battlefield 6 Or Another AAA Game With These CPUsabout 2 hours ago
- Intel Reportedly Eyes Retired TSMC Veteran Wei-Jen Lo to Lead R&D5 days ago
- Intel Reaffirms 14A, Deepens Nvidia Alliance9 days ago
- Intel's pivotal 18A process is making steady progress, but still lags behind — yields only set to reach industry standard levels in 202710 days ago
- Intel posts return to growth and profitability in Q3 2025, but significant challenges remain — achieves $13.7 billion revenue with $4.1 billion operating profit10 days ago
- Trump administration to follow up Intel stake with investment in quantum computing, report claims — tens of millions of CHIPS Act dollars could be paid out to leading companies in exchange for equity11 days ago
- Trump says Intel has made a 'fortune' and America has made $40 billion after the US invested in ailing chipmaker — Intel has gained $73 billion in market cap since investment13 days ago
- TSMC to break ground on 1.4nm fab on Nov 5th13 days ago
- ULTA Beauty: The International Expansion Plan Is Taking Shape24 days ago