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February 6
- Apple to Launch New Chip: 3nm, Mixed Bonding, and 2.5D Packaging
➀ Apple has begun mass production of the next-generation M5 processor for desktops, laptops, and high-performance tablets.
➁ The new SoC is expected to use a performance-enhanced N3P manufacturing process.
➂ The M5 series is rumored to include M5, M5 Pro, M5 Max, and M5 Ultra processors.
➃ The M5 processors will use organic substrates with 'flavor enhancer ABF film' to increase interconnect density and reduce SoC packaging thickness.
➄ High-end M5 Pro, Max, and Ultra versions will use mixed bonding and 2.5D packaging technology.
➅ The SoC will use TSMC's N3P manufacturing technology, which allows for a 4% performance increase or a 9% power consumption decrease at the same clock speed.
➆ Apple's M5 chips are expected to offer significant performance advantages over the M4 CPUp>